SAE ARP1612A

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Polyimide Printed Circuit Boards Fabrication of

Published by Publication Date Number of Pages
SAE 2022

SAE ARP1612A – Polyimide Printed Circuit Boards Fabrication of

This document describes the materials equipment and processing techniques utilized in the fabrication of polyamide printed wiring boards. Included are recommendations for both double-sided and multi-layer boards. The processes described herein are the result of extensive evaluation and manufacturing experience. These recommendations reflect procedures that have proven effective in producing low-cost and reliable printed wiring boards.

Product Details

Published:
06/05/2022
File Size:
1 file 1 MB
Note:
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