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SAE AMS3692C
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Adhesive Compound Epoxy Resin High Temperature Application
| Published by | Publication Date | Number of Pages |
| SAE | 2022 | – |
SAE AMS3692C – Adhesive Compound Epoxy Resin High Temperature Application
This specification covers a two-component adhesive compound an epoxy resin base and a hardener in the form of a paste.This compound has been used typically for non-structural bonding of metals and thermosetting plastics to themselves and to each other and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F) but usage is not limited to such applications.
Product Details
- Published:
- 01/20/2022
- File Size:
- 1 file 110 KB
- Note:
- This product is unavailable in Ukraine Russia Belarus
