SAE AMS3684C

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Resin Polyimide Sealing High-Temperature Resistant 315 ???C (600 ???F) Unfilled (Stabilized: Oct 2016)

Published by Publication Date Number of Pages
SAE 2016

SAE AMS3684C – Resin Polyimide Sealing High-Temperature Resistant 315 ???C (600 ???F) Unfilled (Stabilized: Oct 2016)

This specification covers a single-component unfilled heat-reactive thermosetting aromatic system which thermally cures to form a polyimide polymer structure.

Product Details

Published:
10/13/2016
File Size:
1 file 1000 KB
Note:
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