SAE AMS3692C

SAE AMS3692C – Adhesive Compound Epoxy Resin High Temperature Application

This specification covers a two-component adhesive compound an epoxy resin base and a hardener in the form of a paste.

This compound has been used typically for non-structural bonding of metals and thermosetting plastics to themselves and to each other and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F) but usage is not limited to such applications.

Product Details

Published:

01/20/2022

File Size:

1 file 110 KB

Note:

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