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SAE ARP6415
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Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
| Published by | Publication Date | Number of Pages |
| SAE | 2019 | – |
SAE ARP6415 – Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace defense and high performance (ADHP) product or other products which demand a high reliability.
Product Details
- Published:
- 07/23/2019
- File Size:
- 1 file 1.8 MB
- Note:
- This product is unavailable in Ukraine Russia Belarus
